Joint OCP & JEDEC Workshop – Standards for Chiplet Design with 3DIC Packaging – Day 1 (2024-06-14)
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“Open Compute Project”
This workshop will bring together chip designers, chiplet providers, EDA tool providers, packaging and test houses and foundry partners to discuss developing common data formats, tool interfaces and process flows for a revamped supply chain.
The goal of the workshop is to identify standards…
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